AMAOE 0.12mm Reballing Stencil For iPhone 7-15 Series
AMAOE 0.12mm Reballing Stencil For iPhone 7-15 Series
Spread the cost
Mobicred is a third-party credit option. Approval and terms are determined by Mobicred.
- Approval by Mobicred
- Rate & fees in your pre-agreement
- Repayments confirmed before acceptance
- Your interest rate, fees and repayment schedule are shown in Mobicred's pre-agreement.
- Approval and your credit limit are determined by Mobicred.
- Review the credit terms before accepting the agreement.
Available payment options are confirmed at checkout.
Continue to checkoutDon't have Mobicred yet? Visit Mobicred →
Credit is subject to Mobicred approval and terms. Your limit, interest rate, fees and repayment schedule are disclosed by Mobicred before acceptance. Mobicred terms and conditions
Duties & Import Tax Information
5-10 business days
In Stock
Processing time: 1-3 business days
Couldn't load pickup availability
Description
AMAOE 0.12mm Reballing Stencil is a BGA stencil designed for high-precision chip repairs. It is suitable for reballing tasks on iPhone 7-15 series devices, improving success rates and efficiency in chip repair processes.
- Product Type: BGA Stencils
- Compatibility: iPhone 7-15 Series
- Material: Stainless Steel
- Design: Ultra-thin, 0.12mm
- Intended Use: High-precision chip repairs
- Key Features: Excellent heat resistance, corrosion resistance
- Durability: Highly durable, wear-resistant, capable of hundreds of reuse cycles
- Cutting Technology: Laser micron-level cutting for uniform aperture sizes
- Alignment: Precise hole positions for accurate solder ball alignment
- Efficiency: Improves reballing efficiency and reduces rework rates
- Application: Suitable for individual technicians and professional mass production environments
- Cost-Effectiveness: Lowers repair costs
Questions about features, compatibility, or warranty? Chat with our local support team!
